Avery Dennison Retail Branding and Information Solutions (RBIS) is at PACK EXPO International in Chicago to demonstrate three innovative supply chain visibility and packaging solutions.
The event takes place from 2 -5 November and the company will be at booth #2671 in the South Hall at McCormick Place, Chicago, Illinois.
RBIS will be exhibiting RFID high density read chamber technology, LPA 81x backing paper-free technology, and the IndES™ Elastic Staple® System, providing efficiency improvement, while keeping environmental and cost impacts low.
The RFID high density read chamber technology is a unique configuration of dual antenna technology combined with signal isolation. It improves inventory accuracy and loss prevention, by providing virtually 100% RFID read rates in shipping and receiving areas. The self-contained hardware and software package, and touchpad terminal gathers data reported from the reader, which provides the operator visual feedback on read status and item counts.
LPA 81x powered by Avery Dennison® LightSmart™ Technology is an innovative, backing paper-free, print and apply labelling solution. It offers increased productivity, improved efficiency and reduced environmental impact. Eliminating backing paper reduces downtime for roll changes, saving time and steps, increasing productivity.
Accelerate operational efficiency with flexible label sizes on a single supply roll, reducing supply inventory and eliminating the need to dispose of backing paper waste in landfills.
Avery Dennison® IndES™ Elastic Staple® System is a consumer goods fastening and packing system offering accelerated performance, improved consumer appeal and increased sustainability over conventional fastener packaging.
Maximizing packaging options for quick return on investment (ROI) the design secures items to flat card surfaces or multi-level card packaging designs, while the staples stretch to a wide variety of product shapes and sizes.